| سال | هفته | ID | Title | ApplNo | IPC | Applicant | Subgroup | زیر گروه | رشته | شرح | Description |
|---|
2025 | 52 | WO/2025/261582 | METHOD FOR MANUFACTURING A POLYMER-BASED FREQUENCY COMPONENT | EP2024/066776 | G03F 7/00 | HUAWEI TECHNOLOGIES CO., LTD. | PHYSICS | فیزیک | ابزارها | 2025 | 52 | WO/2025/261682 | METHOD, DEVICE AND SYSTEM FOR SENSOR SURFACE CLEANING | EP2025/063514 | G03F 7/00 | ASML NETHERLANDS B.V. | PHYSICS | فیزیک | ابزارها | 2025 | 52 | WO/2025/261693 | IN-DEVICE OVERLAY METROLOGY USING INVERSE DIE-TO-DATABASE ALIGNMENT | EP2025/063901 | G03F 7/00 | ASML NETHERLANDS B.V. | PHYSICS | فیزیک | ابزارها | 2025 | 52 | WO/2025/261699 | AN ARRANGEMENT FOR A LITHOGRAPHIC APPARATUS | EP2025/063983 | G03F 1/64 | ASML NETHERLANDS B.V. | PHYSICS | فیزیک | ابزارها | 2025 | 52 | WO/2025/261701 | EXPOSURE PROCESS AND APPARATUS | EP2025/064007 | G03F 7/00 | ASML NETHERLANDS B.V. | PHYSICS | فیزیک | ابزارها | 2025 | 52 | WO/2025/261702 | FULL PLANE DIFFRACTION BASED DIGITAL HOLOGRAPHY METROLOGY SYSTEM AND METHOD | EP2025/064026 | G03F 7/00 | ASML NETHERLANDS B.V. | PHYSICS | فیزیک | ابزارها | 2025 | 52 | WO/2025/261849 | OPTICAL SYSTEM AND PROJECTION EXPOSURE APPARATUS | EP2025/066200 | G03F 7/20 | CARL ZEISS SMT GMBH | PHYSICS | فیزیک | ابزارها | 2025 | 52 | WO/2025/262762 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, AND PRINTED WIRING BOARD | JP2024/021923 | G03F 7/004 | RESONAC CORPORATION | PHYSICS | فیزیک | ابزارها | 2025 | 52 | WO/2025/263198 | RADIATION-SENSITIVE COMPOSITION, RESIST PATTERN FORMATION METHOD, POLYMER, AND COMPOUND | JP2025/018059 | G03F 7/039 | JSR CORPORATION | PHYSICS | فیزیک | ابزارها | 2025 | 52 | WO/2025/263199 | RADIATION-SENSITIVE COMPOSITION, RESIST PATTERN FORMING METHOD, POLYMER, AND COMPOUND | JP2025/018066 | G03F 7/039 | JSR CORPORATION | PHYSICS | فیزیک | ابزارها | 2025 | 52 | WO/2025/263206 | METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE AND COMPOSITION | JP2025/018136 | G03F 7/11 | JSR CORPORATION | PHYSICS | فیزیک | ابزارها | 2025 | 52 | WO/2025/263428 | RESIN COMPOSITION, CURED PRODUCT, DISPLAY DEVICE, AND SEMICONDUCTOR DEVICE | JP2025/021287 | G03F 7/023 | TORAY INDUSTRIES, INC. | PHYSICS | فیزیک | ابزارها | 2025 | 52 | WO/2025/263501 | METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND FILM-FORMING COMPOSITION | JP2025/021731 | G03F 7/11 | JSR CORPORATION | PHYSICS | فیزیک | ابزارها | 2025 | 52 | WO/2025/263530 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND SEMICONDUCTOR DEVICE | JP2025/021865 | G03F 7/004 | SUMITOMO BAKELITE CO., LTD. | PHYSICS | فیزیک | ابزارها | 2025 | 52 | WO/2025/263561 | RADIATION-SENSITIVE COMPOSITION, PATTERN FORMING METHOD, COMPOUND, AND POLYMER | JP2025/022045 | G03F 7/004 | JSR CORPORATION | PHYSICS | فیزیک | ابزارها | 2025 | 52 | WO/2025/263595 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMATION METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD | JP2025/022225 | G03F 7/004 | FUJIFILM CORPORATION | PHYSICS | فیزیک | ابزارها | 2025 | 52 | WO/2025/263596 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD | JP2025/022226 | G03F 7/039 | FUJIFILM CORPORATION | PHYSICS | فیزیک | ابزارها | 2025 | 52 | WO/2025/263597 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMATION METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | JP2025/022227 | G03F 7/004 | FUJIFILM CORPORATION | PHYSICS | فیزیک | ابزارها | 2025 | 52 | WO/2025/263599 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD | JP2025/022229 | G03F 7/038 | FUJIFILM CORPORATION | PHYSICS | فیزیک | ابزارها | 2025 | 52 | WO/2025/263600 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMATION METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | JP2025/022230 | G03F 7/004 | FUJIFILM CORPORATION | PHYSICS | فیزیک | ابزارها | 2025 | 52 | WO/2025/263601 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD | JP2025/022231 | G03F 7/038 | FUJIFILM CORPORATION | PHYSICS | فیزیک | ابزارها | 2025 | 52 | WO/2025/263602 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD | JP2025/022232 | G03F 7/039 | FUJIFILM CORPORATION | PHYSICS | فیزیک | ابزارها | 2025 | 52 | WO/2025/263603 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMATION METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | JP2025/022233 | G03F 7/004 | FUJIFILM CORPORATION | PHYSICS | فیزیک | ابزارها | 2025 | 52 | WO/2025/263604 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMATION METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD | JP2025/022234 | G03F 7/004 | FUJIFILM CORPORATION | PHYSICS | فیزیک | ابزارها | 2025 | 52 | WO/2025/263605 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD | JP2025/022235 | G03F 7/039 | FUJIFILM CORPORATION | PHYSICS | فیزیک | ابزارها | 2025 | 52 | WO/2025/263606 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMATION METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD | JP2025/022236 | G03F 7/004 | FUJIFILM CORPORATION | PHYSICS | فیزیک | ابزارها | 2025 | 52 | WO/2025/263607 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD, AND ELECTRONIC DEVICE PRODUCTION METHOD | JP2025/022237 | G03F 7/038 | FUJIFILM CORPORATION | PHYSICS | فیزیک | ابزارها | 2025 | 52 | WO/2025/263608 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMATION METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD | JP2025/022238 | G03F 7/004 | FUJIFILM CORPORATION | PHYSICS | فیزیک | ابزارها | 2025 | 52 | WO/2025/263615 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PRODUCTION METHOD FOR CURED FILM, AND SEMICONDUCTOR DEVICE | JP2025/022301 | G03F 7/004 | ASAHI KASEI KABUSHIKI KAISHA | PHYSICS | فیزیک | ابزارها | 2025 | 52 | WO/2025/264217 | CONTROL OF SEMICONDUCTOR FABRICATION PROCESSES THROUGH AN ENSEMBLE OF MACHINE-LEARNING (ML) MODELS | US2024/034608 | G03F 7/00 | SIEMENS INDUSTRY SOFTWARE INC. | PHYSICS | فیزیک | ابزارها | 2025 | 52 | WO/2025/264425 | UNDERLAYER WITH FLUORINE FOR EXTREME ULTRAVIOLET (EUV) LITHOGRAPHY | US2025/032910 | G03F 7/11 | APPLIED MATERIALS, INC. | PHYSICS | فیزیک | ابزارها | 2025 | 52 | WO/2025/264623 | ALKYLSULFONIC ACID DEVELOPER COMPOSITIONS AND PATTERNING METHODS FOR ORGANOMETALLIC OXIDE PHOTORESISTS | US2025/033903 | G03F 7/004 | INPRIA CORPORATION | PHYSICS | فیزیک | ابزارها | 2025 | 52 | WO/2025/264735 | DEEP-BLACK BORDERS ON EUV RETICLES WITH BLAZED GRATINGS | US2025/034062 | G03F 1/24 | KLA CORPORATION | PHYSICS | فیزیک | ابزارها | 2025 | 52 | WO/2025/265089 | REACTIVE ION BEAM ETCH TO REDUCE LINE-SPACE PATTERN LINE WIDTH ROUGHNESS AND PHOTORESIST LOSS | US2025/034648 | G03F 7/40 | LAM RESEARCH CORPORATION | PHYSICS | فیزیک | ابزارها |